Laser processing equipment

The present disclosure provides a laser machining apparatus (100, 200) for machining a workpiece (140) with a machining beam (130) formed by at least a portion of a provided laser radiation (104), the laser machining apparatus (100, 200) comprising: analysis means for analyzing the radiation, where...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HUESKE, MARC, HOLLER, MARC, MOALEM ANAS, SCHOLTES STEPHAN GERD JOSEPH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure provides a laser machining apparatus (100, 200) for machining a workpiece (140) with a machining beam (130) formed by at least a portion of a provided laser radiation (104), the laser machining apparatus (100, 200) comprising: analysis means for analyzing the radiation, where the radiation is based on the laser radiation (104); and a control device configured to adjust at least one parameter of the machining beam (130) based on the analysis of the radiation. 本公开提供了一种激光加工设备(100，200)，其用于利用由所提供的激光辐射(104)的至少一部分形成的加工光束(130)来加工工件(140)，该激光加工设备(100，200)包括：用于分析辐射的分析装置，其中该辐射基于激光辐射(104)；以及控制装置，其被配置为基于对辐射的分析来调整加工光束(130)的至少一个参数。