Pad repairing method

The invention discloses a bonding pad repairing method, which comprises the following steps of: providing a ceramic substrate with a defective bonding pad, and removing the defective bonding pad on the ceramic substrate; photoresist is spin-coated on the surface, with the defective bonding pad, of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU HAICHAO, HOU KEYU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!