Pad repairing method
The invention discloses a bonding pad repairing method, which comprises the following steps of: providing a ceramic substrate with a defective bonding pad, and removing the defective bonding pad on the ceramic substrate; photoresist is spin-coated on the surface, with the defective bonding pad, of t...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses a bonding pad repairing method, which comprises the following steps of: providing a ceramic substrate with a defective bonding pad, and removing the defective bonding pad on the ceramic substrate; photoresist is spin-coated on the surface, with the defective bonding pad, of the ceramic substrate to form a first photoresist layer; performing first exposure and development on the ceramic substrate by adopting a first drawing to obtain an opening of the defective bonding pad; baking the ceramic substrate to cure the first photoresist layer; plating a metal film on the surface of the first photoresist layer; spin-coating photoresist on the metal film to form a second photoresist layer; performing second exposure and development on the ceramic substrate by adopting a second drawing to obtain an opening of the defective bonding pad; baking the ceramic substrate to cure the second photoresist layer; electroplating the ceramic substrate to obtain a repaired bonding pad; and removing the first |
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