Welding positioning clamp for packaging process
The present disclosure proposes a cable clamp (1) for joining around an exposed conductive core of a cable (9, 10) during a packaging process. The clip (1) is formed as a linear ring having an inner surface (1b) and an outer surface (1a) and opposite ends defining therebetween an opening (5) in the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure proposes a cable clamp (1) for joining around an exposed conductive core of a cable (9, 10) during a packaging process. The clip (1) is formed as a linear ring having an inner surface (1b) and an outer surface (1a) and opposite ends defining therebetween an opening (5) in the ring, by means of which the clip (1) can be engaged around the exposed core (11). The clip (1) has posts (6) distributed around and extending outwardly from an outer surface (1a) thereof. The post (6) engages with an inner surface of an encapsulation mold (13) enclosed around the clip (1) so as to maintain a minimum spacing between the mold (13) and the outer surface of the body around the entire clip and thereby ensure that a minimum thickness of encapsulation sealant (12) is formed around the exposed core of the cable (9, 10) during the encapsulation process.
本公开提出了一种线缆夹(1),用于在封装过程期间接合在线缆(9、10)的露出导电芯周围。夹(1)形成为直线的环,其具有内表面(1b)和外表面(1a)以及相对的端部,相对的端部在它们之间限定了环中的开口(5),夹(1)借助开口(5)可以接合在所述露出芯(11)周围。夹(1)具有绕其外表面(1a)分布并从其外表面( |
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