Lead finger with Z-direction blocking feature

The invention relates to a lead finger with z-direction blocking features. The invention relates to an electronic device (100) having an electrically conductive lead (110) having an inner first section (111) and an outer second section (112) extending outside a molded package structure (108), the fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG MICHAEL, HSIAO HSIANG-MING, HE ZHIJIAN, TU CHI WAH, ZHOU HONGYU, PAN BO-HSUN, JIAN YUHANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a lead finger with z-direction blocking features. The invention relates to an electronic device (100) having an electrically conductive lead (110) having an inner first section (111) and an outer second section (112) extending outside a molded package structure (108), the first section (111) has a blocking feature (121, 122, 123) extending vertically from a top or bottom side (131, 132) of the conductive lead (110) and engaging a portion of the package structure (108) to prevent outward movement of the conductive lead (110) from the package structure (108). 本申请案涉及具有z方向阻挡特征的引线指形件。本发明涉及一种具有导电引线(110)的电子装置(100),所述导电引线具有内部第一区段(111)及在经模制封装结构(108)之外延伸的外部第二区段(112),所述第一区段(111)具有从所述导电引线(110)的顶部或底部侧(131、132)垂直延伸且啮合所述封装结构(108)的一部分以阻止所述导电引线(110)从所述封装结构(108)向外移动的阻挡特征(121、122、123)。