Semiconductor chip

A semiconductor chip includes an active device and a passive device formed over a substrate. And a passivation layer covering the active device and the passive device. And a blocking structure surrounding the active device. The top cover layer forms a crossing blocking structure on the active device...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUA CHANGHUANG, SONG JUNHAN, LIN XICONG, XU RONGHAO, CAI XUXIAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor chip includes an active device and a passive device formed over a substrate. And a passivation layer covering the active device and the passive device. And a blocking structure surrounding the active device. The top cover layer forms a crossing blocking structure on the active device. The cap layer has an opening exposing the blocking structure. 本发明提供了一种半导体芯片包括:有源装置及无源装置形成于基板之上。钝化层,覆盖有源装置及无源装置。阻挡结构,围绕有源装置。顶盖层,于有源装置上形成横跨阻挡结构。顶盖层具有开口露出阻挡结构。