Temperature adjusting device for semiconductor manufacturing device and semiconductor manufacturing system
The invention provides a temperature adjusting device for a semiconductor manufacturing device and a semiconductor manufacturing system, which can reduce the thermal power of a heating part and a cooling part required for setting the temperature of the semiconductor manufacturing device to a target...
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| creator | FUKUSUMI YUKIHIRO NITTA SHINICHI KUNIYASU NORIO |
| description | The invention provides a temperature adjusting device for a semiconductor manufacturing device and a semiconductor manufacturing system, which can reduce the thermal power of a heating part and a cooling part required for setting the temperature of the semiconductor manufacturing device to a target temperature. A temperature adjusting device is provided with: a heating unit for generating a heating liquid; a cooling unit for generating a cooling liquid; a heating liquid delivery pipe for delivering the heating liquid to the semiconductor manufacturing apparatus; a cooling liquid delivery pipe for delivering a cooling liquid to the semiconductor manufacturing apparatus; a heating-side return pipe for returning a liquid mixture of the heating liquid and the cooling liquid, which has passed through the semiconductor manufacturing apparatus, to the heating unit; a cooling-side return pipe for returning the mixed liquid, which has passed through the semiconductor manufacturing apparatus, to the cooling unit; and a |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Temperature adjusting device for semiconductor manufacturing device and semiconductor manufacturing system |
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