Temperature adjusting device for semiconductor manufacturing device and semiconductor manufacturing system

The invention provides a temperature adjusting device for a semiconductor manufacturing device and a semiconductor manufacturing system, which can reduce the thermal power of a heating part and a cooling part required for setting the temperature of the semiconductor manufacturing device to a target temperature. A temperature adjusting device is provided with: a heating unit for generating a heating liquid; a cooling unit for generating a cooling liquid; a heating liquid delivery pipe for delivering the heating liquid to the semiconductor manufacturing apparatus; a cooling liquid delivery pipe for delivering a cooling liquid to the semiconductor manufacturing apparatus; a heating-side return pipe for returning a liquid mixture of the heating liquid and the cooling liquid, which has passed through the semiconductor manufacturing apparatus, to the heating unit; a cooling-side return pipe for returning the mixed liquid, which has passed through the semiconductor manufacturing apparatus, to the cooling unit; and a