Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device

The present invention provides a thermosetting resin composition which can achieve low dielectric properties, high heat resistance, low elastic coefficient and low water absorption in terms of the properties of a cured product, and which has good adhesion to a substrate. A thermosetting resin compos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIZAWA ERI, MIZUGUCHI TAKAFUMI, TAKEDA MAO, YAMAMOTO KAZUYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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