Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device

The present invention provides a thermosetting resin composition which can achieve low dielectric properties, high heat resistance, low elastic coefficient and low water absorption in terms of the properties of a cured product, and which has good adhesion to a substrate. A thermosetting resin composition containing: a bismaleimide compound (A) that contains a structural unit represented by formula (1) and that contains a maleimide group at both ends of a molecular chain; a thermosetting resin or compound (B); (C) a polymerization initiator and/or (D) a hardening accelerator. 本发明提供一种热硬化性树脂组合物，就硬化物的特性而言可实现低介电特性、高耐热性、低弹性系数及低吸水率，且与基材具有良好的接着性。一种热硬化性树脂组合物，包含：双马来酰亚胺化合物(A)，包含下述式(1)所表示的结构单元，且在分子链的两末端包含马来酰亚胺基；热硬化性树脂或化合物(B)；聚合引发剂(C)和/或硬化促进剂(D)。