Interconnection structure between multiple layers of stacked circuits and alignment method
The invention relates to the technical field of electronic equipment structure integration, and particularly discloses an interconnection structure between multilayer stacked circuits and an alignment method, and the interconnection structure comprises a bearing structure, an antenna array plane whi...
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| creator | JING FEI CHEN XIANCAI YU LEI WANG CHAO ZHANG ZHENGHONG YANG FEI ZHONG KAICHAO CHANG YIKUAN |
| description | The invention relates to the technical field of electronic equipment structure integration, and particularly discloses an interconnection structure between multilayer stacked circuits and an alignment method, and the interconnection structure comprises a bearing structure, an antenna array plane which is installed on the bearing structure and is provided with a second SMP radio frequency connector, and a radio frequency sub-array which is installed at the bottom of the bearing structure. The bearing structure comprises a bearing plate, a first positioning pin which is arranged on the bearing plate and is connected with the front surface of the antenna, a second positioning pin which is arranged on the bearing plate and is connected with the radio frequency sub-array, and a first positioning hole which is arranged on the bearing plate and is arranged corresponding to the second SMP radio frequency connector; the second SMP radio frequency connector is installed in the first positioning hole and is connected wi |
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The bearing structure comprises a bearing plate, a first positioning pin which is arranged on the bearing plate and is connected with the front surface of the antenna, a second positioning pin which is arranged on the bearing plate and is connected with the radio frequency sub-array, and a first positioning hole which is arranged on the bearing plate and is arranged corresponding to the second SMP radio frequency connector; the second SMP radio frequency connector is installed in the first positioning hole and is connected wi</description><language>chi ; eng</language><subject>ANALOGOUS ARRANGEMENTS USING OTHER WAVES ; ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; PHYSICS ; PRINTED CIRCUITS ; RADIO DIRECTION-FINDING ; RADIO NAVIGATION ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231013&DB=EPODOC&CC=CN&NR=116887508A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231013&DB=EPODOC&CC=CN&NR=116887508A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JING FEI</creatorcontrib><creatorcontrib>CHEN XIANCAI</creatorcontrib><creatorcontrib>YU LEI</creatorcontrib><creatorcontrib>WANG CHAO</creatorcontrib><creatorcontrib>ZHANG ZHENGHONG</creatorcontrib><creatorcontrib>YANG FEI</creatorcontrib><creatorcontrib>ZHONG KAICHAO</creatorcontrib><creatorcontrib>CHANG YIKUAN</creatorcontrib><title>Interconnection structure between multiple layers of stacked circuits and alignment method</title><description>The invention relates to the technical field of electronic equipment structure integration, and particularly discloses an interconnection structure between multilayer stacked circuits and an alignment method, and the interconnection structure comprises a bearing structure, an antenna array plane which is installed on the bearing structure and is provided with a second SMP radio frequency connector, and a radio frequency sub-array which is installed at the bottom of the bearing structure. 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The bearing structure comprises a bearing plate, a first positioning pin which is arranged on the bearing plate and is connected with the front surface of the antenna, a second positioning pin which is arranged on the bearing plate and is connected with the radio frequency sub-array, and a first positioning hole which is arranged on the bearing plate and is arranged corresponding to the second SMP radio frequency connector; the second SMP radio frequency connector is installed in the first positioning hole and is connected wi</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ANALOGOUS ARRANGEMENTS USING OTHER WAVES ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING |
| title | Interconnection structure between multiple layers of stacked circuits and alignment method |
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