Interconnection structure between multiple layers of stacked circuits and alignment method

The invention relates to the technical field of electronic equipment structure integration, and particularly discloses an interconnection structure between multilayer stacked circuits and an alignment method, and the interconnection structure comprises a bearing structure, an antenna array plane which is installed on the bearing structure and is provided with a second SMP radio frequency connector, and a radio frequency sub-array which is installed at the bottom of the bearing structure. The bearing structure comprises a bearing plate, a first positioning pin which is arranged on the bearing plate and is connected with the front surface of the antenna, a second positioning pin which is arranged on the bearing plate and is connected with the radio frequency sub-array, and a first positioning hole which is arranged on the bearing plate and is arranged corresponding to the second SMP radio frequency connector; the second SMP radio frequency connector is installed in the first positioning hole and is connected wi