Diode packaging structure

The invention discloses a diode packaging structure which comprises a substrate which is electrically connected with a chip. A fluorescent glue layer for condensing light is coated outside the chip, a smooth spherical surface structure or a non-equidistant curved surface structure is arranged above...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN HONGYANG, WAN XIHONG, LIN XINQIANG, RAO YIZHI, LEE SEUNGUL, LIN HOUDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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