Diode packaging structure

The invention discloses a diode packaging structure which comprises a substrate which is electrically connected with a chip. A fluorescent glue layer for condensing light is coated outside the chip, a smooth spherical surface structure or a non-equidistant curved surface structure is arranged above the fluorescent glue layer, and the bottom of the fluorescent glue layer is fixedly connected with the substrate; the fluorescent glue layer is coated with a formed lens used for guiding light, and the bottom of the lens is fixedly connected with the substrate. According to the diode packaging structure provided by the invention, the fluorescent glue layer is dotted at the chip to realize light condensation, and the molded lens is arranged outside to guide light, so that the light emitting angle is expanded. 本发明公开一种二极管封装结构，包括基板，基板上电连接有芯片；在芯片外包覆有用于聚光的荧光胶层，荧光胶层上方为平滑的球面结构或非等距曲面结构，荧光胶层底部与基板固定连接；荧光胶层外部包覆一个成型的透镜，用于引导光线，透镜底部与基板固定连接。本发明提供的二极管封装结构，通过在芯片处点一个荧光胶层实现聚光，外部设置成型透镜引导光线，扩大了发光角度。