HEAT SINK FOR USE WITH SEMICONDUCTOR DEVICE

The invention relates to a heat sink for use with a semiconductor device. Memory devices having heat sinks are disclosed herein. In one embodiment, a memory device includes a first memory coupled to a front side of a substrate, a second memory coupled to a back side of the substrate, and a flexible heat spreader. The flexible heat sink may include graphite and be coupled to back side surfaces of the first and second reservoirs to dissipate heat generated by the first and second reservoirs. 本申请案涉及与半导体装置一起使用的散热器。本文揭示具有散热器的存储器装置。在一个实施例中，存储器装置包含耦合到衬底的前侧的第一存储器、耦合到所述衬底的后侧的第二存储器以及柔性散热器。所述柔性散热器可包含石墨，并且耦合到所述第一及第二存储器的后侧表面，以耗散由所述第一及第二存储器产生的热量。