High-power thick copper wire with high temperature resistance, oxidation resistance and thermal fatigue resistance and manufacturing method thereof

The invention provides a high-power thick copper wire with high temperature resistance, oxidation resistance and thermal fatigue resistance and a manufacturing method thereof. The high-power thick copper wire with high temperature resistance, oxidation resistance and thermal fatigue resistance is co...

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Hauptverfasser: HONG FEIYI, ZHOU ZHENJI, YAN JIN, YU FENGBO, GUO HUADE, WANG XIANMING, ZHOU BOXUAN, PENG ZHENGZHAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a high-power thick copper wire with high temperature resistance, oxidation resistance and thermal fatigue resistance and a manufacturing method thereof. The high-power thick copper wire with high temperature resistance, oxidation resistance and thermal fatigue resistance is composed of copper microalloy. The copper microalloy comprises the following components in percentage by weight: 0.003 to 0.12 percent of trace additive elements and the balance of copper, the trace additive element is a combination of Be, Y and P; and the average grain size of the wire rod structure of the finished thick copper wire is 2-50 [mu] m. The thick copper wire is good in high-temperature resistance, oxidation resistance and power-on fatigue capacity and excellent in ultrasonic welding capacity (welding spot thrust is high, welding wire welding spots are stable, wire arc tension is high, and temperature circulation capacity is excellent). When the thick copper wire is used for high-power semiconductor packa