SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The invention provides a highly reliable semiconductor device and a method for manufacturing the same. According to one embodiment, a semiconductor device includes: a first semiconductor element; a first insulating resin that seals the first semiconductor element; a wiring substrate having a pad; a first wiring extending from the first semiconductor element toward the wiring substrate, the first wiring having a first head portion and a first pillar portion, the first pillar portion being connected to the first semiconductor element, the first head portion being exposed on a surface of the first insulating resin; and a first conductive adhesive that electrically connects the first head of the first wiring and the pad. When a surface of the first head facing the first insulating resin side is defined as a first surface and a surface of the first insulating resin facing the wiring substrate side is defined as a second surface, a distance from the surface of the wiring substrate facing the first insulating resin