Position correction method of wafer correction device and wafer correction device

The invention provides a position correction method of a wafer correction device and the wafer correction device, the device comprises a moving mechanism, a rotating mechanism and a shooting mechanism, the upper part of the rotating mechanism is used for placing a wafer, and the wafer is driven to rotate through rotation; the moving mechanism is connected with the rotating mechanism so as to drive the rotating mechanism to move through movement of the moving mechanism; the shooting mechanism is used for shooting the wafer placed on the rotating mechanism; the wafer is provided with a first mark and a second mark, and the position correction method comprises the steps that when the first mark is located at a preset position in a view field area of a shooting mechanism, a moving mechanism is controlled to move until the second mark is located in the view field area of the shooting mechanism; determining a moving distance of the moving mechanism, a first coordinate of the preset position in a target coordinate s