Double-material plate gradient thermal expansion dot matrix connection method and device
The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and...
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| creator | HOU GENLIANG ZHAO GUAN ZHANG ZE LUO WEIPENG YUAN XIAOJING |
| description | The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and design requirements of the double-material plate; determining a transverse thermal expansion coefficient and a vertical thermal expansion coefficient of each layer of dot matrix according to the total design requirement of the thermal expansion coefficient of the double-material plate; thermal expansion dot matrix units are selected according to the transverse thermal expansion coefficient and the vertical thermal expansion coefficient of each layer of dot matrix; according to the transverse thermal expansion coefficient of each layer of dot matrix, the vertical thermal expansion coefficient of each layer and the thermal expansion coefficient of the material, bidirectional adjustable thermal expansion dot matrix c |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116864045A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116864045A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116864045A3</originalsourceid><addsrcrecordid>eNqNirEKwkAQBdNYiPoP6wcEDMZgK1GxsrKwC-vdizm47B2XVfL5RvADrGYYZp7dj-H18Mh7ViTHnqKfjJ6JrYMoaYfUTxljZBlcELJBabqTG8kEERj91h7aBUsslizezmCZzVr2A1Y_LrL1-XSrLzliaDBENhBoU1-LotpX5abcHbb_PB_Xwjqy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Double-material plate gradient thermal expansion dot matrix connection method and device</title><source>esp@cenet</source><creator>HOU GENLIANG ; ZHAO GUAN ; ZHANG ZE ; LUO WEIPENG ; YUAN XIAOJING</creator><creatorcontrib>HOU GENLIANG ; ZHAO GUAN ; ZHANG ZE ; LUO WEIPENG ; YUAN XIAOJING</creatorcontrib><description>The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and design requirements of the double-material plate; determining a transverse thermal expansion coefficient and a vertical thermal expansion coefficient of each layer of dot matrix according to the total design requirement of the thermal expansion coefficient of the double-material plate; thermal expansion dot matrix units are selected according to the transverse thermal expansion coefficient and the vertical thermal expansion coefficient of each layer of dot matrix; according to the transverse thermal expansion coefficient of each layer of dot matrix, the vertical thermal expansion coefficient of each layer and the thermal expansion coefficient of the material, bidirectional adjustable thermal expansion dot matrix c</description><language>chi ; eng</language><subject>INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=116864045A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=116864045A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOU GENLIANG</creatorcontrib><creatorcontrib>ZHAO GUAN</creatorcontrib><creatorcontrib>ZHANG ZE</creatorcontrib><creatorcontrib>LUO WEIPENG</creatorcontrib><creatorcontrib>YUAN XIAOJING</creatorcontrib><title>Double-material plate gradient thermal expansion dot matrix connection method and device</title><description>The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and design requirements of the double-material plate; determining a transverse thermal expansion coefficient and a vertical thermal expansion coefficient of each layer of dot matrix according to the total design requirement of the thermal expansion coefficient of the double-material plate; thermal expansion dot matrix units are selected according to the transverse thermal expansion coefficient and the vertical thermal expansion coefficient of each layer of dot matrix; according to the transverse thermal expansion coefficient of each layer of dot matrix, the vertical thermal expansion coefficient of each layer and the thermal expansion coefficient of the material, bidirectional adjustable thermal expansion dot matrix c</description><subject>INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwkAQBdNYiPoP6wcEDMZgK1GxsrKwC-vdizm47B2XVfL5RvADrGYYZp7dj-H18Mh7ViTHnqKfjJ6JrYMoaYfUTxljZBlcELJBabqTG8kEERj91h7aBUsslizezmCZzVr2A1Y_LrL1-XSrLzliaDBENhBoU1-LotpX5abcHbb_PB_Xwjqy</recordid><startdate>20231010</startdate><enddate>20231010</enddate><creator>HOU GENLIANG</creator><creator>ZHAO GUAN</creator><creator>ZHANG ZE</creator><creator>LUO WEIPENG</creator><creator>YUAN XIAOJING</creator><scope>EVB</scope></search><sort><creationdate>20231010</creationdate><title>Double-material plate gradient thermal expansion dot matrix connection method and device</title><author>HOU GENLIANG ; ZHAO GUAN ; ZHANG ZE ; LUO WEIPENG ; YUAN XIAOJING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116864045A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HOU GENLIANG</creatorcontrib><creatorcontrib>ZHAO GUAN</creatorcontrib><creatorcontrib>ZHANG ZE</creatorcontrib><creatorcontrib>LUO WEIPENG</creatorcontrib><creatorcontrib>YUAN XIAOJING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOU GENLIANG</au><au>ZHAO GUAN</au><au>ZHANG ZE</au><au>LUO WEIPENG</au><au>YUAN XIAOJING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Double-material plate gradient thermal expansion dot matrix connection method and device</title><date>2023-10-10</date><risdate>2023</risdate><abstract>The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and design requirements of the double-material plate; determining a transverse thermal expansion coefficient and a vertical thermal expansion coefficient of each layer of dot matrix according to the total design requirement of the thermal expansion coefficient of the double-material plate; thermal expansion dot matrix units are selected according to the transverse thermal expansion coefficient and the vertical thermal expansion coefficient of each layer of dot matrix; according to the transverse thermal expansion coefficient of each layer of dot matrix, the vertical thermal expansion coefficient of each layer and the thermal expansion coefficient of the material, bidirectional adjustable thermal expansion dot matrix c</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS PHYSICS |
| title | Double-material plate gradient thermal expansion dot matrix connection method and device |
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