Double-material plate gradient thermal expansion dot matrix connection method and device
The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a double-material plate gradient thermal expansion dot matrix connection method and device. Determining the thermal expansion coefficient of the material and the number of thermal expansion gradient connecting layers of the double-material plate according to the material and design requirements of the double-material plate; determining a transverse thermal expansion coefficient and a vertical thermal expansion coefficient of each layer of dot matrix according to the total design requirement of the thermal expansion coefficient of the double-material plate; thermal expansion dot matrix units are selected according to the transverse thermal expansion coefficient and the vertical thermal expansion coefficient of each layer of dot matrix; according to the transverse thermal expansion coefficient of each layer of dot matrix, the vertical thermal expansion coefficient of each layer and the thermal expansion coefficient of the material, bidirectional adjustable thermal expansion dot matrix c |
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