Mini LED light-emitting device manufacturing method, device, display, equipment and medium
The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip b...
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| creator | SHI WEN LI ZHAOHUI HU HENGGUANG PENG MENGFEI ZHOU YIHANG XIN GAOQIANG YAN DONGCHENG HUANG HEKUN LIU KAIHUAI WANG CHENGMIN LIU YUANQI |
| description | The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip bonding pad on each LED chip deviates from the flexible film; s102, enabling a plurality of LED chip bonding pads of the plurality of LED chips to be in one-to-one correspondence with a plurality of substrate bonding pads on the substrate; s103, applying pressure to one side, deviating from the substrate, of the flexible film in a regional manner, so that the LED chip bonding pad and the substrate bonding pad which correspond to each other are attached to each other; s104, the LED chip bonding pad and the substrate bonding pad which correspond to each other are welded; and S105, the soft film is removed.
本公开提供一种MiniLED发光器件制作方法、器件、显示器、设备及介质。MiniLED发光器件制作方法包括：S101：将多个LED芯片以每个LED芯片上的LED芯片焊盘背离软性膜的方式分别固定在软性膜上；S102：将多个LED |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116845145A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116845145A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116845145A3</originalsourceid><addsrcrecordid>eNqNirEKwjAUALM4iPoPz70dgq10lVpxUCcnlxKS1_ZBkkbzIvj3VugHOB3c3VI8ruQJLs0RLPUD5-iImXwPBt-kEZzyqVOa0-snHfIwmmyOEykGqz4Z4DNRcOgZlDfTZii5tVh0ykbczFyJ7am51-ccw9hiDEqjR27rm5T7qihlUR52_zxfwa86ag</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Mini LED light-emitting device manufacturing method, device, display, equipment and medium</title><source>esp@cenet</source><creator>SHI WEN ; LI ZHAOHUI ; HU HENGGUANG ; PENG MENGFEI ; ZHOU YIHANG ; XIN GAOQIANG ; YAN DONGCHENG ; HUANG HEKUN ; LIU KAIHUAI ; WANG CHENGMIN ; LIU YUANQI</creator><creatorcontrib>SHI WEN ; LI ZHAOHUI ; HU HENGGUANG ; PENG MENGFEI ; ZHOU YIHANG ; XIN GAOQIANG ; YAN DONGCHENG ; HUANG HEKUN ; LIU KAIHUAI ; WANG CHENGMIN ; LIU YUANQI</creatorcontrib><description>The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip bonding pad on each LED chip deviates from the flexible film; s102, enabling a plurality of LED chip bonding pads of the plurality of LED chips to be in one-to-one correspondence with a plurality of substrate bonding pads on the substrate; s103, applying pressure to one side, deviating from the substrate, of the flexible film in a regional manner, so that the LED chip bonding pad and the substrate bonding pad which correspond to each other are attached to each other; s104, the LED chip bonding pad and the substrate bonding pad which correspond to each other are welded; and S105, the soft film is removed.
本公开提供一种MiniLED发光器件制作方法、器件、显示器、设备及介质。MiniLED发光器件制作方法包括：S101：将多个LED芯片以每个LED芯片上的LED芯片焊盘背离软性膜的方式分别固定在软性膜上；S102：将多个LED</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231003&DB=EPODOC&CC=CN&NR=116845145A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231003&DB=EPODOC&CC=CN&NR=116845145A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHI WEN</creatorcontrib><creatorcontrib>LI ZHAOHUI</creatorcontrib><creatorcontrib>HU HENGGUANG</creatorcontrib><creatorcontrib>PENG MENGFEI</creatorcontrib><creatorcontrib>ZHOU YIHANG</creatorcontrib><creatorcontrib>XIN GAOQIANG</creatorcontrib><creatorcontrib>YAN DONGCHENG</creatorcontrib><creatorcontrib>HUANG HEKUN</creatorcontrib><creatorcontrib>LIU KAIHUAI</creatorcontrib><creatorcontrib>WANG CHENGMIN</creatorcontrib><creatorcontrib>LIU YUANQI</creatorcontrib><title>Mini LED light-emitting device manufacturing method, device, display, equipment and medium</title><description>The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip bonding pad on each LED chip deviates from the flexible film; s102, enabling a plurality of LED chip bonding pads of the plurality of LED chips to be in one-to-one correspondence with a plurality of substrate bonding pads on the substrate; s103, applying pressure to one side, deviating from the substrate, of the flexible film in a regional manner, so that the LED chip bonding pad and the substrate bonding pad which correspond to each other are attached to each other; s104, the LED chip bonding pad and the substrate bonding pad which correspond to each other are welded; and S105, the soft film is removed.
本公开提供一种MiniLED发光器件制作方法、器件、显示器、设备及介质。MiniLED发光器件制作方法包括：S101：将多个LED芯片以每个LED芯片上的LED芯片焊盘背离软性膜的方式分别固定在软性膜上；S102：将多个LED</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwjAUALM4iPoPz70dgq10lVpxUCcnlxKS1_ZBkkbzIvj3VugHOB3c3VI8ruQJLs0RLPUD5-iImXwPBt-kEZzyqVOa0-snHfIwmmyOEykGqz4Z4DNRcOgZlDfTZii5tVh0ykbczFyJ7am51-ccw9hiDEqjR27rm5T7qihlUR52_zxfwa86ag</recordid><startdate>20231003</startdate><enddate>20231003</enddate><creator>SHI WEN</creator><creator>LI ZHAOHUI</creator><creator>HU HENGGUANG</creator><creator>PENG MENGFEI</creator><creator>ZHOU YIHANG</creator><creator>XIN GAOQIANG</creator><creator>YAN DONGCHENG</creator><creator>HUANG HEKUN</creator><creator>LIU KAIHUAI</creator><creator>WANG CHENGMIN</creator><creator>LIU YUANQI</creator><scope>EVB</scope></search><sort><creationdate>20231003</creationdate><title>Mini LED light-emitting device manufacturing method, device, display, equipment and medium</title><author>SHI WEN ; LI ZHAOHUI ; HU HENGGUANG ; PENG MENGFEI ; ZHOU YIHANG ; XIN GAOQIANG ; YAN DONGCHENG ; HUANG HEKUN ; LIU KAIHUAI ; WANG CHENGMIN ; LIU YUANQI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116845145A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHI WEN</creatorcontrib><creatorcontrib>LI ZHAOHUI</creatorcontrib><creatorcontrib>HU HENGGUANG</creatorcontrib><creatorcontrib>PENG MENGFEI</creatorcontrib><creatorcontrib>ZHOU YIHANG</creatorcontrib><creatorcontrib>XIN GAOQIANG</creatorcontrib><creatorcontrib>YAN DONGCHENG</creatorcontrib><creatorcontrib>HUANG HEKUN</creatorcontrib><creatorcontrib>LIU KAIHUAI</creatorcontrib><creatorcontrib>WANG CHENGMIN</creatorcontrib><creatorcontrib>LIU YUANQI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHI WEN</au><au>LI ZHAOHUI</au><au>HU HENGGUANG</au><au>PENG MENGFEI</au><au>ZHOU YIHANG</au><au>XIN GAOQIANG</au><au>YAN DONGCHENG</au><au>HUANG HEKUN</au><au>LIU KAIHUAI</au><au>WANG CHENGMIN</au><au>LIU YUANQI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mini LED light-emitting device manufacturing method, device, display, equipment and medium</title><date>2023-10-03</date><risdate>2023</risdate><abstract>The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip bonding pad on each LED chip deviates from the flexible film; s102, enabling a plurality of LED chip bonding pads of the plurality of LED chips to be in one-to-one correspondence with a plurality of substrate bonding pads on the substrate; s103, applying pressure to one side, deviating from the substrate, of the flexible film in a regional manner, so that the LED chip bonding pad and the substrate bonding pad which correspond to each other are attached to each other; s104, the LED chip bonding pad and the substrate bonding pad which correspond to each other are welded; and S105, the soft film is removed.
本公开提供一种MiniLED发光器件制作方法、器件、显示器、设备及介质。MiniLED发光器件制作方法包括：S101：将多个LED芯片以每个LED芯片上的LED芯片焊盘背离软性膜的方式分别固定在软性膜上；S102：将多个LED</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Mini LED light-emitting device manufacturing method, device, display, equipment and medium |
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