Mini LED light-emitting device manufacturing method, device, display, equipment and medium

The invention provides a MiniLED light-emitting device manufacturing method, a device, a display, equipment and a medium. The manufacturing method of the Mini LED light-emitting device comprises the steps that S101, a plurality of LED chips are fixed to a flexible film in the mode that an LED chip bonding pad on each LED chip deviates from the flexible film; s102, enabling a plurality of LED chip bonding pads of the plurality of LED chips to be in one-to-one correspondence with a plurality of substrate bonding pads on the substrate; s103, applying pressure to one side, deviating from the substrate, of the flexible film in a regional manner, so that the LED chip bonding pad and the substrate bonding pad which correspond to each other are attached to each other; s104, the LED chip bonding pad and the substrate bonding pad which correspond to each other are welded; and S105, the soft film is removed. 本公开提供一种MiniLED发光器件制作方法、器件、显示器、设备及介质。MiniLED发光器件制作方法包括：S101：将多个LED芯片以每个LED芯片上的LED芯片焊盘背离软性膜的方式分别固定在软性膜上；S102：将多个LED