PCB dry film resin and preparation method thereof

The invention discloses PCB (printed circuit board) dry film resin and a preparation method thereof, the PCB dry film resin comprises a base film and a functional layer arranged on the base film, the functional layer is prepared from the following raw materials in parts by weight: 25-30 parts of hyp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANG MINGJIE, HU KAIXU, JIN YONGBIAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses PCB (printed circuit board) dry film resin and a preparation method thereof, the PCB dry film resin comprises a base film and a functional layer arranged on the base film, the functional layer is prepared from the following raw materials in parts by weight: 25-30 parts of hyperbranched polysiloxane containing phosphaphenanthrene structure and vinyl, 30-35 parts of diluent, 1-3 parts of 2-vinyl pyrimidine, 1-3 parts of 2, 4-difluoro-2, 3-dichloropyrimidine, 1-3 parts of 2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, the invention relates to a photocuring coating which is prepared from the following components in parts by weight: 2 to 4 parts of 2, 4-diphenyl-4-methyl-1-pentene, 2 to 4 parts of N-(4-cyano-3-trifluoromethylphenyl) methacrylamide, 3 to 5 parts of 3, 9-divinyl-2, 4, 8, 10-tetraoxaspiro [5.5] undecane, 2 to 4 parts of polyethylene glycol diacrylate, 1 to 3 parts of diallyl phthalate, 1 to 3 parts of 2, 2 '-diallyl bisphen