PCB dry film resin and preparation method thereof
The invention discloses PCB (printed circuit board) dry film resin and a preparation method thereof, the PCB dry film resin comprises a base film and a functional layer arranged on the base film, the functional layer is prepared from the following raw materials in parts by weight: 25-30 parts of hyp...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses PCB (printed circuit board) dry film resin and a preparation method thereof, the PCB dry film resin comprises a base film and a functional layer arranged on the base film, the functional layer is prepared from the following raw materials in parts by weight: 25-30 parts of hyperbranched polysiloxane containing phosphaphenanthrene structure and vinyl, 30-35 parts of diluent, 1-3 parts of 2-vinyl pyrimidine, 1-3 parts of 2, 4-difluoro-2, 3-dichloropyrimidine, 1-3 parts of 2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, 4-difluoro-2, the invention relates to a photocuring coating which is prepared from the following components in parts by weight: 2 to 4 parts of 2, 4-diphenyl-4-methyl-1-pentene, 2 to 4 parts of N-(4-cyano-3-trifluoromethylphenyl) methacrylamide, 3 to 5 parts of 3, 9-divinyl-2, 4, 8, 10-tetraoxaspiro [5.5] undecane, 2 to 4 parts of polyethylene glycol diacrylate, 1 to 3 parts of diallyl phthalate, 1 to 3 parts of 2, 2 '-diallyl bisphen |
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