AI module

An AI module (1) is provided with a first semiconductor chip (101). The first semiconductor chip (101) includes a plurality of operation blocks (211) each executing a predetermined operation, and a plurality of memory blocks (221) each including a memory. In a plan view, the plurality of operation b...

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Bibliographische Detailangaben
Hauptverfasser:	OBATA KOJI, SONODA YUTAKA, KABE TATSUYA, MITSUHASHI MASATOMO, GOMYO HIROYUKI, SASAGO MASARU, NAKAGAWA MASAMICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An AI module (1) is provided with a first semiconductor chip (101). The first semiconductor chip (101) includes a plurality of operation blocks (211) each executing a predetermined operation, and a plurality of memory blocks (221) each including a memory. In a plan view, the plurality of operation blocks (211) and the plurality of memory blocks (221) are arranged in a checkerboard shape or a stripe shape. AI模块(1)具备第1半导体芯片(101)。第1半导体芯片(101)包括每一个都执行规定的运算的多个运算块(211)、以及每一个都包括存储器的多个内存块(221)。在平面图中，多个运算块(211)以及多个内存块(221)被排列成棋盘格状或条纹状。