Substrate for mounting electronic component

The electronic component mounting substrate includes: a substrate having a mounting region on an upper surface thereof, the mounting region having an electronic component mounted thereon; and a first metal film located in the mounting region, the first metal film having: a first region including a c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMAMOTO ATSUO, INOMOTO ARATA, ONIMARU TAISHI, KAWASAKI JOJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!