Substrate for mounting electronic component
The electronic component mounting substrate includes: a substrate having a mounting region on an upper surface thereof, the mounting region having an electronic component mounted thereon; and a first metal film located in the mounting region, the first metal film having: a first region including a c...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!