Substrate for mounting electronic component

The electronic component mounting substrate includes: a substrate having a mounting region on an upper surface thereof, the mounting region having an electronic component mounted thereon; and a first metal film located in the mounting region, the first metal film having: a first region including a center portion of the first metal film; and a second region located at least partially around the first region, the second region having a thick film portion in which the film thickness of the second region is greater than the film thickness of the first region. As a result, it is possible to reduce the unexpected flow of a connecting material for connecting the mounting region and the electronic component to the outside. In addition, coating expansion of the connecting material is promoted. 电子元件安装用基板具有：基板，在上表面具有安装电子元件的安装区域；和第1金属膜，位于所述安装区域，所述第1金属膜具有：包含所述第1金属膜的中央部的第1区域；和位于所述第1区域的周围的至少一部分的第2区域，所述第2区域具有所述第2区域的膜厚比所述第1区域的膜厚大的厚膜部。由此，能减少将安装区域和电子元件连接的连接材料预料外地流到外侧。此外，促进了连接材料涂布扩展。