Resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device

The resin composition according to the present invention comprises: a bismaleimide compound (A) that contains a structural unit represented by formula (1) and that contains a maleimide group at both ends of a molecular chain; a resin or compound (B); and a photocuring initiator (C). The resin or compound (B) is at least one selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate ester compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group. In formula (1), R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. And R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. And each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1-16 carbon atoms, or a linear or br