Glue for producing white copper-clad plate with high heat resistance and high reflectivity and product thereof

The invention discloses glue for producing a white copper-clad plate with high heat resistance and high reflectivity, which comprises the following components in percentage by mass: alicyclic epoxy resin, trifunctional epoxy resin and styrene-maleic anhydride, the mass ratio of the alicyclic epoxy r...

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Bibliographische Detailangaben
Hauptverfasser:	YE FEILONG, WANG SHUNCHENG, ZHANG YOUMEI, QIU YIN, LIU LING, LIAO HAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	The invention discloses glue for producing a white copper-clad plate with high heat resistance and high reflectivity, which comprises the following components in percentage by mass: alicyclic epoxy resin, trifunctional epoxy resin and styrene-maleic anhydride, the mass ratio of the alicyclic epoxy resin to the trifunctional epoxy resin is (1-3): 1, and the mass ratio of the styrene-maleic anhydride to the trifunctional epoxy resin is (1-3): 1. The adding amount of the styrene-maleic anhydride is 60-80% of the mass of the corresponding resin. The invention also discloses a preparation method and application of the glue. According to the copper-clad plate disclosed by the invention, the alicyclic epoxy resin and the trifunctional epoxy resin are compounded, the styrene-maleic anhydride is used as a cross-linking agent, the titanium dioxide, the fused silicon dioxide, the aluminum hydroxide and the glass microspheres in a specific proportion are supplemented to obtain the glue, and the copper-clad plate product