Method for removing oxidation layer on surface of DBC copper layer

The invention discloses a method for removing an oxide layer on the surface of a DBC (Direct Bonding Copper) copper layer, which comprises the following steps: S1, inversely buckling an IGBT (Insulated Gate Bipolar Translator) module of which the oxide layer is to be removed into a limiting jig, and enabling the oxide layer on the IGBT module to face upwards; s2, removing an oxide layer on the IGBT module by using a deoxidation laser device; and S3, cleaning the IGBT module by using an air gun. The method for removing the oxide layer on the surface of the DBC copper layer has the advantages of being high in safety, free of foreign matter residues and free of corroding other parts or materials. 本发明公开了一种DBC铜层表面氧化层去除方法，包括步骤：S1、将待除氧化层的IGBT模块倒扣至限位治具内，IGBT模块上的氧化层朝上；S2、由除氧化激光设备将IGBT模块上的氧化层清除；S3、使用气枪清理IGBT模块。本发明的DBC铜层表面氧化层去除方法，具有安全性高、无异物残留和不腐蚀其他的零件或材料的优点。