Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition
The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux re...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KIMURA TAKETO TANGE FUMIYOSHI UESUGI NAOYUKI |
| description | The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux resistance, matte appearance and flexibility. A photosensitive resin composition which contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler that is talc having a cumulative volume fraction of 50 vol% and a particle diameter D50 of 0.7-5.5 [mu] m, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and which is characterized in that: the inorganic filler (B) is talc having a cumulative volume fraction of 50 vol% and having a particle diameter D50 of 0.7-5.5 [mu] m; the (C) photopolymerization initiator contains at least one selected from the group consisting of (C1) alpha-aminoalkylphenyl ketone photopolymerization initiators and (C2) oxime ester ph |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116804821A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116804821A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116804821A3</originalsourceid><addsrcrecordid>eNqNTbsKwjAUzeIg6j9cdwWjIl2lKE7i4F5ietME2tyQpPVH_GAT6uAkTufNmbLXTVOkgDaYaAYEj8FYkNQ5yg5ZELYGl0uy95iop7qXEaJGj6RWY-6NjSl8mkQaeJDwNWgxZPG1VabtgNRo_fics4kSbcDFB2dseT7dy8saHVUYnJBoMVbllfNDsdkXW37c_dN5AyaMUq0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition</title><source>esp@cenet</source><creator>KIMURA TAKETO ; TANGE FUMIYOSHI ; UESUGI NAOYUKI</creator><creatorcontrib>KIMURA TAKETO ; TANGE FUMIYOSHI ; UESUGI NAOYUKI</creatorcontrib><description>The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux resistance, matte appearance and flexibility. A photosensitive resin composition which contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler that is talc having a cumulative volume fraction of 50 vol% and a particle diameter D50 of 0.7-5.5 [mu] m, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and which is characterized in that: the inorganic filler (B) is talc having a cumulative volume fraction of 50 vol% and having a particle diameter D50 of 0.7-5.5 [mu] m; the (C) photopolymerization initiator contains at least one selected from the group consisting of (C1) alpha-aminoalkylphenyl ketone photopolymerization initiators and (C2) oxime ester ph</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230926&DB=EPODOC&CC=CN&NR=116804821A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230926&DB=EPODOC&CC=CN&NR=116804821A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIMURA TAKETO</creatorcontrib><creatorcontrib>TANGE FUMIYOSHI</creatorcontrib><creatorcontrib>UESUGI NAOYUKI</creatorcontrib><title>Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition</title><description>The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux resistance, matte appearance and flexibility. A photosensitive resin composition which contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler that is talc having a cumulative volume fraction of 50 vol% and a particle diameter D50 of 0.7-5.5 [mu] m, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and which is characterized in that: the inorganic filler (B) is talc having a cumulative volume fraction of 50 vol% and having a particle diameter D50 of 0.7-5.5 [mu] m; the (C) photopolymerization initiator contains at least one selected from the group consisting of (C1) alpha-aminoalkylphenyl ketone photopolymerization initiators and (C2) oxime ester ph</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNTbsKwjAUzeIg6j9cdwWjIl2lKE7i4F5ietME2tyQpPVH_GAT6uAkTufNmbLXTVOkgDaYaAYEj8FYkNQ5yg5ZELYGl0uy95iop7qXEaJGj6RWY-6NjSl8mkQaeJDwNWgxZPG1VabtgNRo_fics4kSbcDFB2dseT7dy8saHVUYnJBoMVbllfNDsdkXW37c_dN5AyaMUq0</recordid><startdate>20230926</startdate><enddate>20230926</enddate><creator>KIMURA TAKETO</creator><creator>TANGE FUMIYOSHI</creator><creator>UESUGI NAOYUKI</creator><scope>EVB</scope></search><sort><creationdate>20230926</creationdate><title>Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition</title><author>KIMURA TAKETO ; TANGE FUMIYOSHI ; UESUGI NAOYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116804821A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIMURA TAKETO</creatorcontrib><creatorcontrib>TANGE FUMIYOSHI</creatorcontrib><creatorcontrib>UESUGI NAOYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIMURA TAKETO</au><au>TANGE FUMIYOSHI</au><au>UESUGI NAOYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition</title><date>2023-09-26</date><risdate>2023</risdate><abstract>The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux resistance, matte appearance and flexibility. A photosensitive resin composition which contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler that is talc having a cumulative volume fraction of 50 vol% and a particle diameter D50 of 0.7-5.5 [mu] m, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and which is characterized in that: the inorganic filler (B) is talc having a cumulative volume fraction of 50 vol% and having a particle diameter D50 of 0.7-5.5 [mu] m; the (C) photopolymerization initiator contains at least one selected from the group consisting of (C1) alpha-aminoalkylphenyl ketone photopolymerization initiators and (C2) oxime ester ph</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN116804821A |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS |
| title | Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T13%3A57%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIMURA%20TAKETO&rft.date=2023-09-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116804821A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |