Photosensitive resin composition and photocured product thereof, and printed wiring board having photocured film of photosensitive resin composition

The invention provides a photosensitive resin composition and a photocured product thereof, and a printed wiring board having a photocured film of the photosensitive resin composition. The photosensitive resin composition can form a protective film having insulation reliability and excellent flux resistance, matte appearance and flexibility. A photosensitive resin composition which contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler that is talc having a cumulative volume fraction of 50 vol% and a particle diameter D50 of 0.7-5.5 [mu] m, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and which is characterized in that: the inorganic filler (B) is talc having a cumulative volume fraction of 50 vol% and having a particle diameter D50 of 0.7-5.5 [mu] m; the (C) photopolymerization initiator contains at least one selected from the group consisting of (C1) alpha-aminoalkylphenyl ketone photopolymerization initiators and (C2) oxime ester ph