Copper-ceramic bonded body, brazing filler metal, and method for producing copper-ceramic bonded body

The invention provides a copper-ceramic bonded body, a brazing filler metal, and a method for manufacturing the copper-ceramic bonded body. Provided is a copper-ceramic bonded body having high bonding strength, which comprises a copper material comprising Cu or a Cu alloy, a ceramic material bonded...

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Hauptverfasser: NOGAWA GENYA, OKISHIRO KENJI, OKAMOTO ATSUSHI, TAKANO SUGURU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a copper-ceramic bonded body, a brazing filler metal, and a method for manufacturing the copper-ceramic bonded body. Provided is a copper-ceramic bonded body having high bonding strength, which comprises a copper material comprising Cu or a Cu alloy, a ceramic material bonded to the copper material and comprising a nitride of Si or Al, and a bonding layer that is formed on the bonding surface between the copper material and the ceramic material and contains Cu and Mg, the bonding layer further contains at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd, and Er, and the shear strength of the bonding layer is 10 MPa or more. 本发明提供一种铜陶瓷接合体、钎料及铜陶瓷接合体的制造方法。本发明提供一种具有高接合强度的铜陶瓷接合体,其具有:由Cu或Cu合金构成的铜材、与铜材接合且由Si或Al的氮化物构成的陶瓷材料、以及接合层,该接合层形成于铜材与陶瓷材料的接合面,包含Cu和Mg,进一步包含选自由Ti、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Ca、Y、Ce、La、Sm、Yb、Nd、Gd、Er组成的组中的至少一种活性金属元素,接合层的剪切强度为10MPa以上。