Film-like adhesive and method for manufacturing connection structure

A film-like adhesive (1) for circuit connection, which contains solder particles (2) having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%, a radical polymerizable compound, and a thermal radical initiator, and wherein the average particle diameter of the solder particles (2) is 0.6-1....

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Bibliographische Detailangaben
Hauptverfasser:	MATSUZAKI TOSHIAKI, TAKAIRA HIROSHI, TOMISAKA KATSUHIKO, SATO MAYUMI, HOSHI KATSUAKI, KIKUCHI KENTA, IZAWA HIROYUKI, OKOSHI MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A film-like adhesive (1) for circuit connection, which contains solder particles (2) having a Bi content of 20-60 mass% and an Sn content of 40-80 mass%, a radical polymerizable compound, and a thermal radical initiator, and wherein the average particle diameter of the solder particles (2) is 0.6-1.5 times the thickness (d1) of the film-like adhesive. 一种膜状黏合剂(1)，其为电路连接用膜状黏合剂(1)，其含有：Bi含量为20～60质量％且Sn含量为40～80质量％的焊料粒子(2)、自由基聚合性化合物及热自由基引发剂，焊料粒子(2)的平均粒径为膜状黏合剂的厚度(d1)的0.6～1.5倍。