Ceramic vacuum chuck suitable for adsorbing wafer and production method for reducing surface scratch rate of wafer

The invention relates to the technical field of ceramic vacuum chucks for the semiconductor industry, and discloses a ceramic vacuum chuck suitable for adsorbing a wafer and a production method for reducing the surface scratch rate of the wafer. The ceramic vacuum suction cup comprises a suction cup base and porous ceramic installed on the suction cup base, and the porous ceramic is prepared through the following steps that silicon carbide ceramic with the interior being densely sintered serves as a matrix, air holes are formed in the silicon carbide ceramic through a laser ablation method, and the silicon carbide ceramic is placed in a hydrofluoric acid solution to be cleaned; taking out, ultrasonically cleaning in isopropanol, and washing with water; the ultrasonic power is 20-100 W, and the ultrasonic cleaning time is longer than or equal to 30 min. According to the ceramic vacuum chuck, particulate matter falling and blocking are not prone to being generated, the initial adsorption capacity is high, the a