Preparation method of special-shaped semiconductor target material

The invention discloses a preparation method of a special-shaped semiconductor target material, relates to the field of semiconductor target material preparation, and aims to solve the problems of high preparation cost and poor internal structure uniformity of the conventional special-shaped semiconductor target material. (2) preparing a mold and equipment; 3) preheating the raw materials; 4) forging and pressing; 5) rolling: selecting cold rolling or hot rolling according to different materials of the raw materials; (6) annealing is conducted, specifically, different annealing temperatures and heat preservation time are set according to different materials of the raw materials; (7) secondary forging and pressing are conducted, specifically, different die sizes are designed according to the sizes of finished products, and the raw materials are placed on the forging and pressing die after being preheated for forging and pressing; and (8) machining is conducted, specifically, the forged and pressed special-shap