Process condition sensing apparatus

In accordance with one or more embodiments of the present disclosure, a housing assembly is disclosed. The housing assembly includes a top portion. The housing assembly further includes a bottom portion. The top portion is removably connectable to the bottom portion via one or more coupling devices. The top portion is further reversibly electrically coupleable to the bottom portion via one or more electronic contacts. One or more electronic components are disposed within the housing assembly. 根据本公开的一或多个实施例，公开一种壳体组合件。所述壳体组合件包含顶部部分。所述壳体组合件进一步包含底部部分。所述顶部部分能经由一或多个耦合装置可拆卸地连接到所述底部部分。所述顶部部分进一步能经由一或多个电子接触件可逆地电耦合到所述底部部分。一或多个电子组件经安置于所述壳体组合件内。