Boost module of high-voltage pulse generator and three-dimensional stacking integration method
The invention provides a high-voltage pulse generator boosting module and a three-dimensional stacking integration method, the boosting module comprises a three-dimensional stacking structure formed after at least two substrates are assembled, each substrate is a multi-layer wiring high-temperature...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a high-voltage pulse generator boosting module and a three-dimensional stacking integration method, the boosting module comprises a three-dimensional stacking structure formed after at least two substrates are assembled, each substrate is a multi-layer wiring high-temperature co-fired ceramic substrate with a single-sided cavity or a double-sided cavity, the bottom surface of the cavity of the substrate is used as a mounting surface of various components, and the bottom surface of the cavity of the substrate is used as a mounting surface of the components. The upper surface and the lower surface of the substrate serve as leading-out faces of interconnection signals between the substrates. Pole needles or plated-through holes are designed on the signal leading-out surfaces of the substrates and are used for electrical interconnection and structural connection between the substrates; a pin or jack structure is designed on the signal leading-out surface of the boosting module input end sub |
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