Light emitting diode and preparation method thereof
The invention provides a light emitting diode and a preparation method thereof, and belongs to the technical field of photoelectron manufacturing. The light-emitting diode comprises an epitaxial laminated layer, an electrode and a solder ball, the electrode is located on the epitaxial laminated laye...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a light emitting diode and a preparation method thereof, and belongs to the technical field of photoelectron manufacturing. The light-emitting diode comprises an epitaxial laminated layer, an electrode and a solder ball, the electrode is located on the epitaxial laminated layer, the electrode is provided with a first surface and a side wall connected with the first surface, the side wall of the electrode is provided with a resistance increasing structure, the resistance increasing structure comprises a groove and/or a protrusion, and the groove and/or the protrusion are/is connected with the first surface. The solder ball is connected with the first surface and the resistance increasing structure. According to the invention, the connection reliability of the solder ball and the electrode can be improved, and the problem that the solder ball falls off from the electrode is prevented.
本公开提供了一种发光二极管及其制备方法,属于光电子制造技术领域。该发光二极管包括外延叠层、电极和焊球,所述电极位于所述外延叠层上,所述电极具有第一表面和与所述第一表面相连的侧壁,所述电极的侧壁具有增阻结构,所述 |
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