Full-automatic feeding and charging equipment for semiconductor packaging process

The invention relates to a full-automatic feeding and charging device for a semiconductor packaging process, and relates to the technical field of semiconductor packaging. The number of the limiting plates is two, the two limiting plates are both vertically connected with the mounting base, and the two limiting plates are coplanar; the adjusting plate is located between the two limiting plates, the adjusting plate and the limiting plates are coplanar, the adjusting plate is perpendicular to the mounting base, and the adjusting plate penetrates through the mounting base and slides in the length direction of the adjusting plate; the adjusting cylinder is connected with the adjusting plate and the mounting seat and used for driving the adjusting plate to slide in the length direction; the clamping rod is vertically connected to the same side of the limiting plate and the adjusting plate; the clamping rod is used for clamping a wafer; the adjusting air cylinder is located in the bearing box, and the mounting base