Laminating device for processing high-precision semiconductor assembly

The invention discloses a high-precision laminating device for processing a semiconductor component, which comprises a support frame and a bracket, the support frame is connected with the bracket, a mechanical arm is arranged above the support frame, the inner side of the support frame is provided with a conveying belt structure capable of driving the semiconductor component to move, the inner side of the bracket supports a gluing part, and the gluing part is arranged on the inner side of the bracket. The gluing part comprises a glue box fixed to the top of the support, a transfer structure is arranged below the glue box, and an exhaust structure fixed to the inner side of the support is arranged at the tail end of the transfer structure; and the injection structure extends to the outer side of the injection structure from one side of the exhaust structure, and a temperature control pipe capable of conducting temperature control is arranged on the outer side of the injection structure. According to the gluing