Organic glue for copper powder welding

The invention relates to organic glue for copper powder welding, and belongs to the technical field of organic glue. According to the invention, the polyisoprene rubber is creatively used in the organic adhesive, and the polyisoprene rubber can be degraded at high temperature, so that the influence...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIM SAI KIT, ZHU JINSHUI, XIONG FUHUA, HE XIANHAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to organic glue for copper powder welding, and belongs to the technical field of organic glue. According to the invention, the polyisoprene rubber is creatively used in the organic adhesive, and the polyisoprene rubber can be degraded at high temperature, so that the influence of organic matter residues on a welding repair surface can be greatly improved; according to the organic adhesive provided by the invention, the high-temperature-resistant environment-friendly hydrocarbon solvent is adopted, so that the storage stability of the organic adhesive is greatly improved, and meanwhile, the storage period of the organic adhesive is obviously prolonged; according to the organic adhesive provided by the invention, the solid content is increased by adopting the modified resin, and the adhesive force of the copper powder and the organic adhesive is obviously improved, which has a positive effect on the effectiveness of bonding at a high temperature in the later period; according to the modifi