Method for determining technological parameters of selective laser melting
The invention provides a selective laser melting process parameter determination method which is applied to electronic equipment and comprises the following steps: determining preset deformation of a to-be-formed part; determining a target energy density corresponding to the preset deformation accor...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a selective laser melting process parameter determination method which is applied to electronic equipment and comprises the following steps: determining preset deformation of a to-be-formed part; determining a target energy density corresponding to the preset deformation according to the preset deformation and preset first information; determining at least one initial process parameter corresponding to the target energy density according to the target energy density and preset second information; and according to a preset condition, the initial process parameters meeting the preset condition are screened out from the initial process parameters to serve as target process parameters. Therefore, the preset deformation amount of the to-be-formed part is determined in advance, and the target process parameters corresponding to the to-be-formed part are reversely derived from the preset deformation amount, that is, the influence of different process parameters on the forming deformation amoun |
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