Mask design for improved attachment location

A semiconductor device has a semiconductor package that includes a substrate having a contact grid array. The component is disposed over the substrate. An encapsulant is deposited over the component. The contact grid array is held outside of the encapsulant. A metal mask with fiducial marks is disposed over the contact grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after the shielding layer is formed. 一种半导体器件具有半导体封装，所述半导体封装包括具有接点栅格阵列的基板。组件设置在基板之上。在组件之上沉积封装物。接点栅格阵列保持在封装物之外。具有基准标记的金属掩模设置在接点栅格阵列之上。在半导体封装之上形成屏蔽层。在形成屏蔽层之后去除金属掩模。