MOUNTING APPARATUS, INSPECTION APPARATUS, ELEMENT ASSEMBLY METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

The invention provides a mounting apparatus, an inspection apparatus, an element assembly method, and a semiconductor device manufacturing method for improving inspection accuracy of a bonding material. This mounting device is provided with: an imaging device facing a bonding material having a specular reflection surface; an illumination device having a light source provided above the bonding material; and a control device configured to inspect the bonding material on the basis of a plurality of images obtained by changing the irradiation position of the light source and imaging the bonding material by the imaging device. 本发明提供一种用于使接合材料的检查精度提高的安装装置、检查装置、元件组装方法及半导体器件的制造方法。安装装置具备：摄像装置，其面向具有镜面反射面的接合材料；照明装置，其具有设于所述接合材料的上方的光源；和控制装置，其构成为基于改变所述光源的照射位置并由所述摄像装置拍摄所述接合材料而得到的多个图像来检查所述接合材料。