Epoxy resin composition and electronic component device

The invention relates to an epoxy resin composition and an electronic component device. This epoxy resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom and a chain hydrocarbon group having 6 or more carbon at...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUSUMADA MITSUAKI, SHIBA SHIZUKA, KAWABATA YASUNORI, YAMANAKA KENICHI, KANG DONGCHUL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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