Epoxy resin composition and electronic component device

The invention relates to an epoxy resin composition and an electronic component device. This epoxy resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom and a chain hydrocarbon group having 6 or more carbon at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUSUMADA MITSUAKI, SHIBA SHIZUKA, KAWABATA YASUNORI, YAMANAKA KENICHI, KANG DONGCHUL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention relates to an epoxy resin composition and an electronic component device. This epoxy resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a silicon atom and a chain hydrocarbon group having 6 or more carbon atoms are bonded. 本发明涉及一种环氧树脂组合物和电子部件装置。本发明的环氧树脂组合物含有环氧树脂、固化剂、无机填充材、以及硅烷化合物，所述硅烷化合物具有碳原子数大于或等于6的链状烃基与硅原子结合而成的结构。