Cooling device for forming substrate glass through overflow method and using method of cooling device

The invention discloses a cooling device for overflow method substrate glass forming and a using method thereof, and belongs to the technical field of glass manufacturing. According to the cooling device for substrate glass forming through the overflow method, the device is preassembled in forming equipment before production, meanwhile, the heat insulation angle and the opening size of the water pipe body can be controlled by adjusting rotation of the heat insulation device according to the glass production state during production, and the purpose of reducing the temperature of a glass plate area is achieved; meanwhile, hot-state water pipe inserting and pulling operation is avoided, and the working intensity can be greatly reduced; a plurality of groups of water pipe assemblies can be preassembled, and can be combined and adjusted according to glass temperature adjustment requirements in actual production, namely, combination of different opening sizes and different angles can be carried out, and different p