GUIDE WIRE DEVICE, BINDING APPARATUS AND BINDING METHOD

The invention provides a wire guiding device, bundling equipment and a bundling method. The wire guiding device comprises a U-shaped arm arranged around three faces of a radiator, and the U-shaped arm forms a first guiding arm and a second guiding arm on the two sides of the radiator respectively; the U-shaped arm comprises a fixed U-shaped plate which is fixedly arranged and a movable U-shaped plate which is movably arranged on one side of the fixed U-shaped plate, and wire feeding grooves which extend from the end of the first guide arm to the end of the second guide arm and penetrate through the whole U-shaped arm are formed in the surfaces of any side or two sides, opposite to the movable U-shaped plate, of the fixed U-shaped plate. The wire guide device provides a channel for the metal wire to surround the radiator, so that the metal wire can advance in the wire guide device to surround the radiator (partially) under the driving of the wire feeding head, the process of the metal wire is realized only und