Placement method for accurate positioning placement of large components on target area of substrate, and associated placement device

Placement method for accurate positioning placement of large components on target area of substrate, and associated placement device

The invention describes a placement method for the accurate positioning placement of large components with pins on a target area of a substrate, in particular a printed circuit board, and a placement device for this purpose. 本发明描述了用于在基底、特别是印刷电路板的目标区域上准确定位放置具有引脚的大部件的放置方法，以及用于此目的的放置设备。...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PALA, APARNA, VUPPALA SAI-KRISHNA, KLEIN MARIUS
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PICTORIAL COMMUNICATION, e.g. TELEVISION
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The invention describes a placement method for the accurate positioning placement of large components with pins on a target area of a substrate, in particular a printed circuit board, and a placement device for this purpose. 本发明描述了用于在基底、特别是印刷电路板的目标区域上准确定位放置具有引脚的大部件的放置方法，以及用于此目的的放置设备。