Method for forming thin film on surface of ceramic substrate

The invention discloses a method for forming a thin film on the surface of a ceramic substrate, which comprises the following steps of: providing a multi-layer ceramic substrate which comprises a top layer serving as a via hole layer; the top layer of the multilayer ceramic substrate is coated with...

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Bibliographische Detailangaben
Hauptverfasser: YU HAICHAO, HOU KEYU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a method for forming a thin film on the surface of a ceramic substrate, which comprises the following steps of: providing a multi-layer ceramic substrate which comprises a top layer serving as a via hole layer; the top layer of the multilayer ceramic substrate is coated with photosensitive metal glue and then cured; performing first exposure and development on the top layer of the multi-layer ceramic substrate by adopting a first mask to form a first rewiring layer; carrying out first sintering on the multilayer ceramic substrate after the first exposure and development; depositing a dielectric layer on the first rewiring layer; coating photoresist on the dielectric layer; performing second exposure and development on the multilayer ceramic substrate by adopting a second mask, and removing the photoresist at the via hole; etching the medium in the via hole; cleaning the photoresist; coating and curing photosensitive metal glue on the surface of the dielectric layer; performing third ex