Method for forming thin film on surface of ceramic substrate
The invention discloses a method for forming a thin film on the surface of a ceramic substrate, which comprises the following steps of: providing a multi-layer ceramic substrate which comprises a top layer serving as a via hole layer; the top layer of the multilayer ceramic substrate is coated with...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a method for forming a thin film on the surface of a ceramic substrate, which comprises the following steps of: providing a multi-layer ceramic substrate which comprises a top layer serving as a via hole layer; the top layer of the multilayer ceramic substrate is coated with photosensitive metal glue and then cured; performing first exposure and development on the top layer of the multi-layer ceramic substrate by adopting a first mask to form a first rewiring layer; carrying out first sintering on the multilayer ceramic substrate after the first exposure and development; depositing a dielectric layer on the first rewiring layer; coating photoresist on the dielectric layer; performing second exposure and development on the multilayer ceramic substrate by adopting a second mask, and removing the photoresist at the via hole; etching the medium in the via hole; cleaning the photoresist; coating and curing photosensitive metal glue on the surface of the dielectric layer; performing third ex |
---|